Method for designing layout of semiconductor device and method for manufacturing semiconductor device using the same

ABSTRACT

A method of manufacturing a semiconductor device includes configuring a layout pattern; and forming conductive lines corresponding to the layout pattern on a substrate, wherein configuring the layout pattern includes: arranging pre-conductive patterns and post-conductive patterns for a first logic cell, a second logic cell, and a third logic cell; rearranging the pre-conductive patterns and the post-conductive patterns so that two conductive patterns that are adjacent to a boundary between two adjacent logic cells from among the first logic cell, the second logic cell, and the third logic cell are formed by different photolithography processes; and arranging conductive patterns for a dummy cell arranged between the second logic cell and the third logic cell.

CROSS-REFERENCE TO RELATED APPLICATION(S)

This application is a Divisional Application of U.S. application Ser.No. 15/094,764 filed Apr. 8, 2016, which claims priority under 35 U.S.C.§119 from Korean Patent Application Nos. 10-2015-0050150 filed Apr. 9,2015, and 10-2015-0127787 filed Sep. 9, 2015, in the Korean IntellectualProperty Office, the entire contents of which are hereby incorporated byreference.

BACKGROUND 1. Field

Apparatuses and methods consistent with exemplary embodiments relate toa layout design method of a semiconductor device, and more particularly,relate to a layout design method of a semiconductor device includingfield effect transistors and a method of manufacturing a semiconductordevice using the same.

2. Related Art

To increase the capacity of a semiconductor device and to reduce amanufacturing cost, there are many efforts to increase the degree ofintegration of a semiconductor device because the degree of integrationis an important factor for determining a product price. Because thedegree of integration is determined according to an area which a unitcell occupies, it is important to effectively design a layout of asemiconductor device. Generally, designing a layout of a semiconductordevice using a layout design tool requires significant time, and trialand error. Therefore, it is important to shorten a layout design time.

SUMMARY

According to an aspect of an exemplary embodiment, there is provided amethod of reducing a layout design time, which increases according tothe insertion of a dummy cell, at a layout design of a semiconductordevice.

According to an aspect of an exemplary embodiment, a method ofmanufacturing a semiconductor device is provided. The method may includeproviding pre-conductive lines and post-conductive lines for forming afirst logic cell, a second logic cell, a dummy cell, and a third logiccell, the first logic cell and the second logic cell being adjacent toeach other and the dummy cell and the third logic cell being adjacent toeach other. A first conductive line, which is adjacent to the secondlogic cell, from among conductive lines of the first logic cell may bespaced a first reference distance apart from a second conductive line,which is adjacent to the first logic cell, from among conductive linesof the second logic cell. A dummy line, which is adjacent to the thirdlogic cell, from among conductive lines of the dummy cell is spaced asecond reference distance apart from a third conductive line, which isadjacent to the dummy cell, from among conductive lines of the thirdlogic cell. The second reference distance is greater than the firstreference distance.

The first reference distance and the second reference distance may beset based on a resolution of a photolithography process for forming thepre-conductive lines and the post-conductive lines.

The first conductive line and the second conductive line may be formedby a patterning process using different photomasks, and the dummy lineand the third conductive line may be formed by a patterning processusing a same photomask. A fourth conductive line, which is adjacent tothe dummy cell, from among conductive lines of the second logic cell andthe third conductive line may be formed by a patterning process usingdifferent photomasks.

At least a portion of the first conductive line, the second conductiveline, the third conductive line, and the dummy line may be arranged in afirst direction perpendicular to a direction in which the first logiccell, the second logic cell, the third logic cell, and the dummy cellmay be arranged. The method may further include providing first powerlines and second power lines arranged in a second directionperpendicular to the first direction before providing the pre-conductivelines and the post-conductive lines. A ground voltage may be provided toone of the first power lines and the second power lines.

The dummy cell may be one of filler, a filling capacitor, and a sparecell.

The method may further include before forming the pre-conductive linesand the post-conductive lines, forming an active pattern on a substrate,forming a gate pattern crossing the active pattern, and forming a sourcearea and a drain area on the active pattern located at opposite sides ofthe gate pattern. At least one of the pre-conductive lines may beelectrically connected to the gate pattern and at least one of thepost-conductive lines may be electrically connected to the gate pattern,and another line of the pre-conductive lines may be electricallyconnected to the source area and the drain area and at least anotherline of the post-conductive lines may be electrically connected to thesource area and the drain area.

According to an aspect of an exemplary embodiment, a method ofmanufacturing a semiconductor device is provided. The method may includeforming a layout pattern, and configuring conductive lines correspondingto the layout pattern on a substrate. Configuring the layout pattern mayinclude arranging pre-conductive patterns and post-conductive patternsfor a first logic cell, a second logic cell, and a third logic cell,rearranging the pre-conductive patterns and the post-conductive patternsso that two conductive patterns that are adjacent to a boundary betweentwo adjacent logic cells from among the first logic cell, the secondlogic cell, and the third logic cell are formed by differentphotolithography processes, and arranging conductive patterns for adummy cell arranged between the second logic cell and the third logiccell. A first conductive pattern, which is adjacent to the second logiccell, from among conductive patterns of the first logic cell may bespaced a first reference distance apart from a second conductivepattern, which is adjacent to the first logic cell, from amongconductive patterns of the second logic cell, and a dummy pattern, whichis adjacent to the third logic cell, from among conductive patterns ofthe dummy cell may be spaced a second reference distance apart from athird conductive pattern, which is adjacent to the dummy cell, fromamong conductive patterns of the third logic cell. The second referencedistance is greater than the first reference distance.

The first reference distance and the second reference distance may beset based on a resolution of a photolithography process for forming thepre-conductive patterns and the post-conductive patterns.

The first conductive pattern and the second conductive pattern may beformed by a patterning process using different photomasks, and the dummyline and the third conductive pattern may be formed by a patterningprocess using the same photomask.

A fourth conductive pattern, which is adjacent to the dummy cell, fromamong conductive patterns of the second logic cell and the thirdconductive pattern may be formed by a patterning process using differentphotomasks.

At least two of the first conductive pattern, the second conductivepattern, the third conductive pattern, and the dummy pattern may bearranged in a first direction perpendicular to a direction in which thefirst logic cell, the second logic cell, the third logic cell, and thedummy cell are arranged.

The dummy cell may be one of filler, a filling capacitor, and a sparecell.

According to an aspect of an exemplary embodiment, a method ofmanufacturing a semiconductor device is provided. The method includes:providing a first conductive line, which is adjacent to a second logiccell, from among conductive lines of a first logic cell, the firstconductive line being spaced a first reference distance apart from asecond conductive line, which is adjacent to the first logic cell, fromamong conductive lines of the second logic cell; and providing a dummyline, which is adjacent to a third logic cell, from among conductivelines of a dummy cell, the dummy line being spaced a second referencedistance apart from a third conductive line, which is adjacent to thedummy cell, from among conductive lines of the third logic cell. Thesecond reference distance is greater than the first reference distance.

The first reference distance and the second reference distance may beset based on a resolution of a photolithography process for formingpre-conductive lines and post-conductive lines.

The first conductive line and the second conductive line may be formedby a patterning process using different photomasks, and the dummy lineand the third conductive line may be formed by a patterning processusing a same photomask.

The dummy cell may be one from among a filler, a filling capacitor, anda spare cell.

BRIEF DESCRIPTION OF THE FIGURES

The above and other objects and features will become apparent from thefollowing description with reference to the following figures, whereinlike reference numerals refer to like parts throughout the variousfigures unless otherwise specified, and wherein

FIG. 1 is a block diagram illustrating a computing system for designinga semiconductor device according to an exemplary embodiment;

FIG. 2 is flowchart illustrating a method for designing andmanufacturing a semiconductor device according to an exemplaryembodiment;

FIG. 3 is a flowchart illustrating operation S120 illustrated in FIG. 2;

FIGS. 4 to 6 are diagrams illustrating layout patterns for describing alayout design method according to an exemplary embodiment;

FIGS. 7A, 8A, 9A and 10A are plan views illustrating a manufactureprocess of a semiconductor device according to an exemplary embodiment;

FIGS. 7B, 8B, 9B and 10B are cross-sectional views taken along linesI-I′ of FIGS. 7A, 8A, 9A and 10A, respectively;

FIGS. 7C, 8C, 9C and 10C are cross-sectional views taken along linesII-II′ of FIGS. 7A, 8A, 9A and 10A, respectively;

FIGS. 7D, 8D, 9D and 10D are cross-sectional views taken along III-III′of FIGS. 7A, 8A, 9A and 10A, respectively;

FIGS. 9E and 10E are cross-sectional views taken along lines IV-IV′ ofFIGS. 9A and 10A, respectively; and

FIG. 11 is a block diagram exemplarily illustrating a SSD manufacturedby a method for designing a layout of a semiconductor device, accordingto an exemplary embodiment.

DETAILED DESCRIPTION

It is to be understood that both the foregoing general description andthe following detailed description are provided as examples, forillustration and not for limiting the scope of the inventive concept.Reference will now be made in detail to the exemplary embodiments, whichare illustrated in the accompanying drawings. Wherever possible, thesame reference numbers are used in the drawings and the description torefer to the same or like parts.

It will be understood that when an element is referred to as being“connected,” or “coupled,” to another element or layer, it can bedirectly connected or coupled to the other element or interveningelements may be present. In contrast, when an element is referred to asbeing “directly connected,” or “directly coupled,” to another element,there are no intervening elements present. As used herein, the term“and/or,” includes any and all combinations of one or more of theassociated listed items.

Although the terms first, second, etc. may be used herein to describevarious elements, components, regions, layers and/or sections, it shouldbe understood that these elements, components, regions, layers and/orsections should not be limited by these terms. These terms are used onlyto distinguish one element, component, region, layer, or section fromanother region, layer, or section. Thus, a first element, component,region, layer, or section discussed below could be termed a secondelement, component, region, layer, or section without departing from theteachings of the inventive concept.

Spatially relative terms, such as “beneath”, “below”, “lower”, “above”,“upper”, and the like, may be used herein for ease of description todescribe one element or feature's relationship to another element(s) orfeature(s) as illustrated in the figures. It will be understood that thespatially relative terms are intended to encompass differentorientations of the device in use or operation in addition to theorientation depicted in the figures. For example, if the device in thefigures is turned over, elements described as “below” or “beneath” otherelements or features would then be oriented “above” the other elementsor features.

The terminology used herein is for the purpose of describing particularexemplary embodiments only and is not intended to be limiting ofexemplary embodiments. As used herein, the singular forms “a,” “an,” and“the,” are intended to include the plural forms as well, unless thecontext clearly indicates otherwise. As used herein, the terms “and/or”and “at least one of” include any and all combinations of one or more ofthe associated listed items. It will be further understood that theterms “comprises,” “comprising,” “includes,” and/or “including,” whenused herein, specify the presence of stated features, integers, steps,operations, elements, and/or components, but do not preclude thepresence or addition of one or more other features, integers, steps,operations, elements, components, and/or groups thereof.

Below, exemplary embodiments will be described with reference toaccompanying drawings in order to describe the exemplary embodiments indetail to the extent that one skilled in the art can easily implementthe scope and spirit of the inventive concept.

FIG. 1 is a block diagram illustrating a computing system for designinga semiconductor device, according to an exemplary embodiment. Referringto FIG. 1, a computing system 100 may include at least one processor110, a working memory 120, an input/output device 130, and a storagedevice 140. Here, the computing system 100 may be provided as adedicated device for designing a layout according to an exemplaryembodiment. Moreover, the computing system 100 may be configured todrive various design and verification simulation programs.

The processor 110 may execute software (e.g., application program,operating system (OS), device drivers, etc.) to be executed in thecomputing system 100. The processor 110 may execute an OS (not shown)loaded in the working memory 120. The processor 110 may execute variousapplication programs to be driven based on an operating system. Forexample, the processor 110 may execute a layout design tool 122 loadedin the working memory 120.

An OS or application programs may be loaded in the working memory 120.When the computing system 100 is booted up, an OS image (not shown) maybe loaded onto the working memory 120 based on a booting sequence. Anoverall input/output operation of the computing system 100 may besupported by an OS. Likewise, application programs which are selected bya user to provide a basic service may be loaded in the working memory120. Moreover, the layout design tool 122 for a layout design accordingto an exemplary embodiment may be also loaded from the storage device140 to the working memory 120.

The layout design tool 122 may include a biasing function for changing aform and a position of a specific layout pattern different from a formand a position defined by a design rule. Moreover, the layout designtool 122 may perform a design rule check (DRC) in the changed biasingdata condition. The working memory 120 may include a volatile memorysuch as a static random access memory (SRAM) or a dynamic random accessmemory (DRAM). However, the working memory 120 may include, but is notlimited to, a nonvolatile memory such as a phase change random accessmemory (PRAM), a magnetoresistive random-access memory (MRAM), aresistance random access memory (ReRAM), a ferroelectric random accessmemory (FRAM), a flash memory.

The simulation tool 124 for performing an optical proximity correction(OPC) about designed layout data may be further loaded in the workingmemory 120.

The input/output device 130 may include various devices, which arecapable of receiving information from a designer or providinginformation to a designer, such as a keyboard, a mouse, and a monitor.For example, a processing procedure and a processing result, or the likeof the simulation tool 124 may be displayed through the input/outputdevice 130.

The storage device 140 may be a storage medium of the computing system100. The storage device 140 may store an application program, an OSimage, and various kinds of data. For example, the storage device 140may be a solid state drive (SSD), an embedded multimedia card (eMMC), ora hard disk drive (HDD). The storage device 140 may include a NAND Flashmemory. Alternatively, the storage device 140 may include, but is notlimited to, a nonvolatile memories such as a PRAM, a MRAM, a ReRAM, anda FRAM or a NOR flash memory.

FIG. 2 is flowchart illustrating a method for designing andmanufacturing a semiconductor device according to an exemplaryembodiment.

In operation S110, a high level design about a semiconductor integratedcircuit may be performed using the computing system 100 illustrated inFIG. 1. The high level design may mean describing an integrated circuit,which is a design target, with a high-level language of a hardwaredescription language (HDL). For example, a high-level language such as Clanguage may be used. Circuits designed using the high level design maybe specifically expressed using a register transfer level (RTL) codingand may be verified using a RTL simulation. Furthermore, a codegenerated by the RTL coding may be changed into a netlist, and thenetlist may be synthesized into a semiconductor device of a top level.The synthesized schematic circuit may be verified by the simulation tool124, and an adjustment process may be performed based on a verificationresult.

In operation S120, a layout design for implementing a semiconductorintegrated circuit, which is logically completed, on a silicon substratemay be performed. For example, the layout design may be performed basedon a schematic circuit or a netlist corresponding thereto, which issynthesized in a high level design. The layout design may include arouting process for placing and connecting various standard cellsprovided from a cell library based on a prescribed design rule. In alayout design according to an exemplary embodiment, to overcome alimitation of a resolution of a photolithography process, rearrangingconductive patterns adjacent to a boundary between adjacent logic cellsmay be provided thereto. Moreover, arranging conductive patterns forforming dummy cells between logic cells may be provided after therearranging of the conductive patterns. This will be described later indetail.

A cell library for expressing a circuit of a specific gate-level as alayout may be defined in a layout design tool. The layout may be aprocedure for defining a form or a size of a pattern for forming atransistor and conductive lines formed on a silicon substrate. Forexample, to actually form an inverter circuit on a silicon substrate,layout patterns such as a p-channel metal oxide semiconductor (PMOS), ann-channel metal oxide semiconductor (NMOS), N-WELL, a gate electrode,and conductive lines arranged thereon may be properly arranged. To thisend, firstly, a proper one of inverters already defined in a celllibrary may be retrieved and selected. Moreover, a routing of selectedand arranged standard cells may be performed. The above-describedprocesses may be automatically or manually performed by the layoutdesign tool.

After routing, a layout may be verified to determine whether there is aportion violating a design rule. As an example of a verificationoperation, there may be a design rule check (DRC) for verifying whethera layout is properly set to fit a design rule, an electrical rule check(ERC) for verifying whether a layout is properly connected to each otherwithout an electrical disconnection, a layout vs schematic (LVS) forrecognizing whether a layout corresponds to a gate-level netlist.

In operation S130, an optical proximity correction (OPC) may beperformed. Layout patterns obtained through a layout design may beimplemented on a silicon substrate using a photolithography process.Here, the OPC may be a technology for correcting a distortion phenomenongenerated in a photolithography process. That is, the distortionphenomenon such as refraction generated due to a characteristic of alight during an exposure using a pattern, in which a layout wasperformed, or a process effect may be corrected through the OPC. Whenthe OPC is performed, a form and a position of designed layout patternsmay be finely adjusted.

In operation S140, the photomasks may be manufactured based on a layoutchanged by the OPC. Generally, the photomask may be manufactured using achrome thin film coated on a glass substrate with a method of depictinglayer patterns.

In operation S150, a semiconductor device may be manufactured using themanufactured photomask. In a manufacture process of a semiconductordevice using the photomask, various types of exposure and etch processesmay be repeated. Through such processes, patterns formed in a layoutdesign may be sequentially formed on a silicon substrate.

FIG. 3 is a flowchart illustrating operation 5120 illustrated in FIG. 2.FIGS. 4 to 6 are diagrams illustrating layout patterns for describing alayout design method according to an exemplary embodiment. FIGS. 4 to 6illustrate a swapping process for determining sets of conductive linesto be formed by the same photolithography process.

Below, in terms defined herein, “conductive pattern” may mean a “virtualconductive line” generated by a layout design tool, and “conductiveline” may mean a “real conductive line” formed by a photolithographyprocess using the conductive pattern.

Referring to FIGS. 3 and 4, in operation 5122, conductive patterns forforming a first logic cell LC1, a second logic cell LC2, and a thirdlogic cell LC3 may be randomly arranged. Conductive patterns generatedby the layout design tool may be an original layout. For example,forming the original layout may include arranging lower/upper conductivepatterns and via patterns. In detail, the conductive patterns mayinclude pre-conductive patterns and post-conductive patterns.

The pre-conductive patterns may include conductive patterns M11, M12,M13, and M14, and the post-conductive patterns may include conductivepatterns M21, M22, M23, and M24. Moreover, before the pre-conductivepatterns M11, M12, M13, and M14 and the post-conductive patterns M21,M22, M23, and M24 are arranged, power lines PL1 and PL2 may be arranged.For example, a power voltage may be provided to the first power linePL1, and a ground voltage may be provided to the second power line PL2.

The pre-conductive patterns M11, M12, M13, and M14 and thepost-conductive patterns M21, M22, M23, and M24 may include a lineextending in a first direction D1 and/or a second direction D2. Aphotolithography process forming the pre-conductive patterns M11, M12,M13, and M14 may be different from a photolithography process formingthe post-conductive patterns M21, M22, M23, and M24. For example, thepre-conductive patterns M11, M12, M13, and M14 may be formed by a firstphotolithography process. After the first photolithography process isperformed, the post-conductive patterns M21, M22, M23, and M24 may beformed by a second photolithography process. In FIG. 4, conductivepatterns formed by the same photolithography process are shown as usingthe same hatching line. For example, the pre-conductive patterns to beformed by the first photolithography process are illustrated usinghatching lines inclined to the left, and the post-conductive patterns tobe formed by the second photolithography process are illustrated usinghatching lines inclined to the right.

However, the conductive patterns of the original layout generated by thelayout design tool may be arbitrarily arranged without consideration ofa resolution of a photolithography process for forming real conductivelines. For example, in the original layout, the conductive pattern M11and the conductive pattern M12 may be formed by the firstphotolithography process, but because a distance between the conductivepattern M11 and the conductive pattern M12 is very short, it isimpossible to form once a semiconductor integrated circuit by the firstphotolithography process due to a characteristic of a manufacturingprocess. To solve the problem, the swapping operation may be performedby the layout design tool.

Referring to FIGS. 3, 4 and 5, in operation S124, an operation forrearranging the pre-conductive patterns and the post-conductive patternsmay be performed. This may be performed to address the problems aboutthe above-described resolution of a photolithography process.

For example, the pre-conductive patterns and the post-conductivepatterns may be rearranged such that conductive patterns, which areadjacent to a boundary between two logic cells adjacent to each other,are formed by different photolithography processes from each other. Whenthere is exemplified the conductive patterns M22, M12, and M23constituting the second logic cell LC2, the conductive patterns M12 maybe arranged to be formed by the first photolithography process, and theconductive patterns M22 and M23 may be arranged to be formed by thesecond photolithography process Likewise, referring to conductivepatterns M13, M14, and M24 constituting the third logic cell LC3, theconductive patterns M13 and M14 may be rearranged to be formed by thefirst photolithography process, and the conductive patterns M24 may berearranged to be formed by the second photolithography process.

As a result, conductive patterns which are adjacent to a boundarybetween two logic cells adjacent to each other may be formed bydifferent photolithography processes from each other, thereby resolvinga problem generated by a resolution of a photolithography process. Forexample, a photolithography processes for forming the conductive patternM11 may be different from a photolithography processes for forming theconductive pattern M22.

Referring to FIGS. 3, 4 and 6, in operation S126, conductive patternsM15, M16, and M25 constituting a dummy cell may be arranged. Forexample, the dummy cell may include at least one of a filler, a fillingcapacitor, or a spare cell. The filler may fill an empty space generatedin a process for designing a layout. The filling capacitor may beprovided between the power lines PL1 and PL2 for a stable power supply.The spare cell may be a cell for preparing an additional design, after alayout design is completed.

According to an exemplary embodiment, an additional swapping operationdue to insertion of a dummy cell between logic cells may not beperformed. That is, two conductive patterns adjacent to a boundarybetween a logic cell and a dummy cell may be formed by the samephotolithography process. For example, in FIG. 6, the conductive patternM16 and the conductive pattern M13 may be formed by the samephotolithography process. Because an additional swapping operation aboutconductive patterns based on insertion of a dummy cell DC is omitted, alayout design time may be reduced. In a general layout design process,conductive patterns of the third logic cell LC3 may be rearranged due toinsertion of the dummy cell DC. That is, an additional swappingoperation may be performed such that a photolithography process forforming the conductive pattern M16 may be different from aphotolithography process for forming the conductive pattern M13.

However, according to an exemplary embodiment, the conductive patternsof an inserted dummy cell may be spaced apart from conductive patternsof a logic cell, which is adjacent to the dummy cell, by a referencedistance or more, instead of performing an additional swapping operationdue to insertion of the dummy cell. In an exemplary embodiment, it isassumed that the dummy cell DC having the conductive patterns M15, M16,and M25 illustrated in FIG. 6 is provided between the second logic cellLC2 and the third logic cell LC3.

Firstly, the conductive patterns M23 and M13, which are adjacent to thedummy cell DC, from among the conductive patterns of the second andthird logic cells LC2 and LC3 adjacent to each other with the dummy cellinterposed therebetween may be rearranged to be formed by differentphotolithography processes based on a swapping operation which isperformed before the dummy cell DC is inserted. Moreover, the dummypattern M16, which is adjacent to the third logic cell LC3, from amongthe conductive patterns of the dummy cell DC may be spaced apart fromthe conductive patterns M13 by a reference distance s2 or more. Forexample, the reference distance s2 may be determined in consideration ofa resolution of a photolithography process. Moreover, the referencedistance s2 may be greater than a distance s1 between the conductivepatterns (e.g., M11 and M22) adjacent to a boundary between two logiccells (e.g., LC1 and LC2) adjacent to each other.

However, it may not be required that the dummy pattern M15 is spacedapart from the conductive pattern M23 by the reference distance s2 ormore, because a photolithography process for forming the conductivepattern M15 may be different from a photolithography process for formingthe conductive pattern M23. When a layout is designed such that thedummy pattern M15 is formed by the same photolithography process as theconductive pattern M23, the dummy pattern M15 and the conductive patternM23 may be arranged to be spaced apart by the reference distance s2 ormore.

As described above, an exemplary embodiment is exemplified as after thepre-conductive patterns and the post-conductive patterns are randomlyarranged in a layout design, a swapping operation about conductivepatterns of logic cells is performed. However, according to an exemplaryembodiment, when logic cells are arranged, conductive patterns adjacentto a boundary between logic cells may be arranged to be formed bydifferent photolithography processes from each other, and a swappingoperation may not be performed.

As described above, exemplary embodiments may omit an additionalswapping operation based on insertion of a dummy cell but may arrangedummy patterns of the dummy cell in consideration of a resolution of aphotolithography process, thereby making it possible to reduce a layoutdesign time.

Below, a manufacturing method of a semiconductor device according to anexemplary embodiment is described. FIGS. 7A, 8A, 9A and 10A are planviews illustrating a manufacture process of a semiconductor deviceaccording to an exemplary embodiment. FIGS. 7B, 8B, 9B and 10B arecross-sectional views taken along lines I-I′ of FIGS. 7A, 8A, 9A and10A, respectively. FIGS. 7C, 8C, 9C and 10C are cross-sectional viewstaken along lines II-II′ of FIGS. 7A, 8A, 9A and 10A, respectively.FIGS. 7D, 8D, 9D and 10D are cross-sectional views taken along III-III′of FIGS. 7A, 8A, 9A and 10A, respectively. FIGS. 9E and 10E arecross-sectional views taken along lines IV-IV′ of FIGS. 9A and 10A,respectively.

Referring to FIGS. 7A to 7D, a substrate 100 may be provided. Forexample, the substrate 100 may be a silicon substrate, a germaniumsubstrate, or a silicon-on-insulator (SOI) substrate. An active patternsFN may be formed in an upper portion of the substrate 100. First deviceisolation layers ST1 filling spaces between the active patterns FN maybe formed. Second device isolation layers ST2 for defining a p-channelmetal-oxide-semiconductor field effect transistor (PMOSFET) area PR andan n-channel metal oxide semiconductor field effect transistor (NMOSFET)area NR may be formed in the substrate 100. The first and second deviceisolation layers ST1 and ST2 may be formed by a shallow-trench isolation(STI) process. For example, the first and second device isolation layersST1 and ST2 may include a silicon oxide layer.

Each of the first and second device isolation layers ST1 and ST2 mayhave a depth in a direction opposite to a third direction D3. The thirddirection D3 may be a direction perpendicular to a top surface of thesubstrate 100. For example, the depth of the first device isolationlayers ST1 may be shallower than the depth of the second deviceisolation layers ST2. Here, a process of forming the first deviceisolation layers ST1 may be different from a process of forming thesecond device isolation layers ST2. In an exemplary embodiment, thefirst device isolation layers ST1 may be formed simultaneously with thesecond device isolation layers ST2, and a depth of the first deviceisolation layers ST1 may be substantially equal to a depth of the seconddevice isolation layers ST2.

Gate electrodes GP intersecting the active patterns FN and extending ina first direction may be formed on the active patterns FN. The gateelectrodes GP may be formed to be spaced apart from each other in asecond direction. The gate insulation pattern GI may be formed undereach of the gate electrodes GP, and the gate spacers GS may be formed onboth sidewalls of each of the gate electrodes GP. Furthermore, a cappingpattern CP covering a top surface of each of the gate electrodes GP maybe formed. A first interlayer insulating layer 110 may be formed tocover the gate electrodes GP.

The gate electrodes GP may include at least one of a dopedsemiconductor, metal, or conductive metal nitride. The gate insulationpattern GI may include a silicon oxide layer and/or a silicon oxynitridelayer and may include a high-k dielectric layer of which a dielectricconstant is higher than a dielectric constant of a silicon oxide layer.Each of the capping pattern CP and the gate spacers GS may include atleast one of a silicon oxide layer, a silicon nitride layer, or asilicon oxynitride layer. The first interlayer insulating layer 110 mayinclude a silicon oxide layer or a silicon oxynitride layer.

Source/drain areas SD may be formed on the active pattern FN located atopposite sides (i.e., dual sides) of each of the gate electrodes GP. Thesource/drain areas SD may be p-type or n-type dopant regions.

The source/drain areas SD may include epitaxial patterns formed by aselective epitaxial growth (SEG) process. The source/drain areas SD mayinclude a semiconductor element different from a semiconductor elementof the substrate 100. For example, the source/drain areas SD may includea semiconductor element having a lattice constant greater than orsmaller than a lattice constant of a semiconductor element of thesubstrate 100. The source/drain areas SD may include a semiconductorelement different from a semiconductor element included in the substrate100, thereby applying compressive stress or tensile stress to thechannel areas AF between the source/drain areas SD. For example, whenthe substrate 100 is a silicon substrate, the source/drain areas SD mayinclude embedded silicon-germanium (SiGe) or germanium. In this case,the source/drain areas SD may provide the compressive stress to thechannel areas AF. In an exemplary embodiment, when the substrate 100 isa silicon substrate, the source/drain areas SD of NMOSFET area NR mayinclude a silicon carbide (SiC). In this case, the tensile stress may beapplied to the channel areas AF. As a result, mobility of carriersgenerated in the channel areas AF may be improved.

Source/drain contacts CA may be formed between the gate electrodes GP.The source/drain contacts CA may be in direct contact with thesource/drain areas SD and may be electrically connected thereto. Thesource/drain contacts CA may be provided in the first interlayerinsulating layer 110. At least one of the source/drain contacts CA maybe connected to the source/drain areas SD arranged in the firstdirection D1 in parallel.

Gate contacts CB may be formed in an upper potion of the firstinterlayer insulating layer 110. Each of the gate contacts CB may passthrough the capping pattern CP and may be directly connected to the gateelectrode GP. Bottom surfaces of the gate contacts CB may be higher thanbottom surfaces of the source/drain contacts CA. Furthermore, the bottomsurfaces of the gate contacts CB may be higher than top surfaces of thesource/drain areas SD.

Referring to FIGS. 8A to 8D, a second interlayer insulating layer 120may be formed on the first interlayer insulating layer 110. Moreover,first and second vias V1 and V2 may be formed in the second interlayerinsulating layer 120. The first and second vias V1 and V2 may beelectrically connected to the gate contacts CB. A third interlayerinsulating layer 130 may be formed on the second interlayer insulatinglayer 120.

Conductive line holes MH13 and MH16 which pass through the thirdinterlayer insulating layer 130 may be formed by the firstphotolithography process using a first photomask. The first photomaskmay be manufactured using a first patterning group including theconductive pattern M13 and the dummy pattern M16 described withreference to FIGS. 4 to 6. Here, a distance between the conductive lineholes MH13 and MH16 may be equal to or greater than the referencedistance s2 which is set in consideration of a resolution of aphotolithography process.

In detail, forming the conductive line holes MH13 and MH16 may includemanufacturing the first photomask using the first patterning group,forming a first photolithography pattern on the third interlayerinsulating layer 130, and etching the third interlayer insulating layer130 using the first photolithography pattern as an etch mask to form theconductive line holes MH13 and MH16.

Referring to FIGS. 9A to 9E, a mask layer ML filling the conductive lineholes MH13 and MH16 may be formed. A conductive line hole MH25 whichpasses through the mask layer ML and the third interlayer insulatinglayer 130 may be formed by performing the second photolithographyprocess using a second photomask. The second photomask may bemanufactured using a second patterning group including the conductivepattern M25 described with reference to FIGS. 4 to 6. In detail, theforming of the conductive line hole MH25 may include manufacturing thesecond photomask using the second patterning group, forming a secondphotolithography pattern on the mask layer ML using the secondphotomask, and etching the mask layer ML and the third interlayerinsulating layer 130 using the second photolithography pattern as anetching mask to form the conductive line hole MH25.

Referring to FIGS. 10A to 10E, the mask layer ML may be removed.Moreover, a conductive material may fill the conductive lines holesMH25, MH16, and MH13 to form conductive lines MI25, MI16, and MI13respectively corresponding to the dummy patterns M25 and M16 and theconductive pattern M13 which are illustrated in FIG. 6.

Based on a manufacturing method of a semiconductor device according toan exemplary embodiment, conductive patterns adjacent to a boundarybetween logic cells adjacent to each other may be formed by differentphotolithography processes from each other. On the other hand, theconductive patterns adjacent to a boundary between a dummy cell and alogic cell adjacent to each other may be formed by the samephotolithography process and may be spaced apart from each other by areference distance or more which is set in consideration of a resolutionof a photolithography process. Based on such a manufacturing method, anadditional swapping (i.e., rearrangement of conductive patterns)operation performed after insertion of a dummy cell in a layout designstep may be omitted, thereby reducing a layout design time.

FIG. 11 is a block diagram exemplarily illustrating a SSD manufacturedby a method for designing a layout of a semiconductor device, accordingto an exemplary embodiment. Referring to FIG. 11, a SSD 1000 may includea controller 1100 and a plurality of nonvolatile memories 1200. Thecontroller 1100 and the nonvolatile memories 1200 may include asemiconductor device manufactured according to an above-described layoutdesign method.

The controller 1100 may be connected to the nonvolatile memories 1200through a plurality of channels CH1 to Chi (i.e., i is an integer of 2or more). The nonvolatile memories 1200 connected to the controller 1100through the same channel may be provided in the form of a multi-stackchip. The nonvolatile memories 1200 may be implemented to optionallyreceive an external high-voltage Vppx. Moreover, the controller 1100 mayinclude at least one processor 1110, an error correction circuit 1120, ahost interface 1130, a buffer, and a nonvolatile memory interface 1150.

The host interface 1130 may provide an interface function forinterfacing with an external device. For example, the host interface1110 may be a NAND flash interface. Besides, the host interface 1110 maybe implemented by various interfaces and may be implemented with aplurality of interfaces. The error correction circuit 1120 may calculatea value of an error correction code of data to be programmed in awriting operation, may correct data read in a reading operation based onthe value of the error correction code, and may correct an error of datarecovered from the nonvolatile memories 1200. Although not illustrated,a code memory which stores code data for operating the controller 1100may be further included in the error correction circuit 1120. The codememory may be implemented with a nonvolatile memory. The buffer 1130 maytemporarily store data for operating the controller 1100. The buffer1130 may temporarily store data to be programmed to the nonvolatilememories 1200 or may temporarily store data which was read from thenonvolatile memories 1200. The nonvolatile memory interface 1150 mayprovide an interface function between the controller 1100 and thenonvolatile memories 1200.

Exemplary embodiments may reduce a layout design time, which increaseaccording to insertion of a dummy cell during a layout design of asemiconductor device.

Those of ordinary skill in the art will recognize that various changesand modifications of the exemplary embodiments described herein can bemade without departing from the scope and spirit of the inventiveconcept. Modifications of the inventive concept may be included withinthe scope of the following claims and equivalents.

What is claimed is:
 1. A method of manufacturing a semiconductor device,the method comprising: configuring a layout pattern; and formingconductive lines corresponding to the layout pattern on a substrate,wherein configuring the layout pattern comprises: arrangingpre-conductive patterns and post-conductive patterns for a first logiccell, a second logic cell, and a third logic cell; rearranging thepre-conductive patterns and the post-conductive patterns so that twoconductive patterns that are adjacent to a boundary between two adjacentlogic cells from among the first logic cell, the second logic cell, andthe third logic cell are formed by different photolithography processes;and arranging conductive patterns for a dummy cell arranged between thesecond logic cell and the third logic cell, wherein a first conductivepattern, which is adjacent to the second logic cell, from amongconductive patterns of the first logic cell is spaced a first referencedistance apart from a second conductive pattern, which is adjacent tothe first logic cell, from among conductive patterns of the second logiccell, and wherein a dummy pattern, which is adjacent to the third logiccell, from among conductive patterns of the dummy cell is spaced asecond reference distance apart from a third conductive pattern, whichis adjacent to the dummy cell, from among conductive patterns of thethird logic cell, and wherein the second reference distance is greaterthan the first reference distance.
 2. The method of claim 1, wherein thefirst reference distance and the second reference distance are set basedon a resolution of a photolithography process for forming thepre-conductive patterns and the post-conductive patterns.
 3. The methodof claim 1, wherein the first conductive pattern and the secondconductive pattern are formed by a patterning process using differentphotomasks, and wherein the dummy line and the third conductive patternare formed by a patterning process using the same photomask.
 4. Themethod of claim 3, wherein a fourth conductive pattern, which isadjacent to the dummy cell, from among conductive patterns of the secondlogic cell and the third conductive pattern is formed by a patterningprocess using different photomasks.
 5. The method of claim 1, wherein atleast two of the first conductive pattern, the second conductivepattern, the third conductive pattern, and the dummy pattern arearranged in a first direction perpendicular to a direction in which thefirst logic cell, the second logic cell, the third logic cell, and thedummy cell are arranged.
 6. The method of claim 1, wherein the dummycell is one from among a filler, a filling capacitor, and a spare cell.